TY - CHAP A1 - Michael Shearn A2 - Xiankai Sun A3 - M. David Henry A4 - Amnon Yariv A5 - Axel Scherer ED1 - Jan Grym Y1 - 2010-04-01 PY - 2010 T1 - Advanced Plasma Processing: Etching, Deposition, and Wafer Bonding Techniques for Semiconductor Applications N2 - Semiconductor technologies continue to evolve and amaze us. New materials, new structures, new manufacturing tools, and new advancements in modelling and simulation form a breeding ground for novel high performance electronic and photonic devices. This book covers all aspects of semiconductor technology concerning materials, technological processes, and devices, including their modelling, design, integration, and manufacturing. BT - Semiconductor Technologies SP - Ch. 5 UR - https://doi.org/10.5772/8564 DO - 10.5772/8564 SN - PB - IntechOpen CY - Rijeka Y2 - 2022-05-25 ER -