TY - CHAP A1 - Knut E. Aasmundtveit A2 - Thi-Thuy Luu A3 - Hoang-Vu Nguyen A4 - Andreas Larsson A5 - Torleif A. Tollefsen ED1 - Mahmood Aliofkhazraei Y1 - 2018-05-30 PY - 2018 T1 - Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding N2 - Intermetallic compounds are usually brittle with high melting points. Their properties are often found among ceramic and metallic materials. In most cases, their hot corrosion resistance and simultaneously hardness are important. One of the main applications of intermetallic compounds is for superalloy turbine blades in which they show appropriate high-temperature-related properties. This book collects new developments about intermetallic compounds and their recent usages. BT - Intermetallic Compounds SP - Ch. 3 UR - https://doi.org/10.5772/intechopen.75139 DO - 10.5772/intechopen.75139 SN - 978-1-78923-179-3 PB - IntechOpen CY - Rijeka Y2 - 2021-06-20 ER -